Multiphysics modeling of high density IC encapsulation

A multi-physics modelling approach for simulating the plastic encapsulation of high density IC packages is presented. This modelling approach is used to predict the two-phase flow of a curing resin, the heat transfer in all fluids and solids within the package, and the fluid-structure interactions between the resin and the interconnect wires, all in a fully-coupled solution process. The capabilities of the modelling approach are demonstrated, and the effects of resin transfer process parameters, material properties, mold cavity geometry, and wire count on flow patterns and wire sweep are briefly investigated. This work demonstrates the effectiveness of such high-fidelity modelling tools for virtual prototyping, design, and optimization of the packaging process for electronic components, especially for those with high wire densities.